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Electronic device manufacturing equipment

Laser film Cutting Equipments

overview

  • Type of Laser can be selected according to the processing application of each material (glass, film, resin, etc.)

  • Achieves high-precision processing by combining full-cut and half-cut processing of laser

feature

  • Since there is no mechanical contact like a diamond wheel,
    defects such as scratches, chips, etc. do not occur on the divided surface.

  • Automatic peeling function of the terminal part
    High stability is achieved by laser control using in-house developed software.

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Renova Solutions Co., Ltd.

Renova Solutions Co., Ltd.

Tokyo Head Office

Tama Center Tosei Building 3F, 1-15-2 Ochiai,

Tama City, Tokyo 206-0033

 

 

Osaka Branch

〒550-0005

1-6-2 Nishihonmachi, Nishi-ku, Osaka  Awabori Building 3F

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