top of page

Electronic device manufacturing equipment

Laser film Cutting Equipments



  • Type of Laser can be selected according to the processing application of each material (glass, film, resin, etc.)

  • Achieves high-precision processing by combining full-cut and half-cut processing of laser


  • Since there is no mechanical contact like a diamond wheel,
    defects such as scratches, chips, etc. do not occur on the divided surface.

  • Automatic peeling function of the terminal part
    High stability is achieved by laser control using in-house developed software.

DIT レーザー.png
bottom of page