Electronic device manufacturing equipment

Laser film Cutting Equipments

​overview

overview

  • Type of Laser can be selected according to the processing application of each material (glass, film, resin, etc.)

  • Achieves high-precision processing by combining full-cut and half-cut processing of laser

feature

  • Since there is no mechanical contact like a diamond wheel,
    defects such as scratches, chips, etc. do not occur on the divided surface.

  • Automatic peeling function of the terminal part
    High stability is achieved by laser control using in-house developed software.

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