Electronic device manufacturing equipment
Laser film Cutting Equipments
Type of Laser can be selected according to the processing application of each material (glass, film, resin, etc.)
Achieves high-precision processing by combining full-cut and half-cut processing of laser
Since there is no mechanical contact like a diamond wheel,
defects such as scratches, chips, etc. do not occur on the divided surface.
Automatic peeling function of the terminal part
High stability is achieved by laser control using in-house developed software.