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Electronic device manufacturing equipment
Laser film Cutting Equipments
overview
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Type of Laser can be selected according to the processing application of each material (glass, film, resin, etc.)
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Achieves high-precision processing by combining full-cut and half-cut processing of laser
 
feature
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Since there is no mechanical contact like a diamond wheel,
defects such as scratches, chips, etc. do not occur on the divided surface. - 
Automatic peeling function of the terminal part
High stability is achieved by laser control using in-house developed software. 

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