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Electronic device manufacturing equipment

Film forming equipment (Sputtering equipment)

overview

  • Thin-film deposition of oxides and metal materials on a large substrate in a vacuum state

  • Used in the FPD & semiconductor industry

feature

・ Transport method: Horizontal / vertical

・ Minimize the amount of deflection: Max 0.1mm

In-line Sputter (Vertical Type).jpg

Renova Solutions Co., Ltd.

Renova Solutions Co., Ltd.

Tokyo Head Office

Tama Center Tosei Building 3F, 1-15-2 Ochiai,

Tama City, Tokyo 206-0033

 

 

Osaka Branch

〒550-0005

1-6-2 Nishihonmachi, Nishi-ku, Osaka  Awabori Building 3F

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