Electronic device manufacturing equipment

Laser cutting system

​overview

overview

・ Laser can be selected according to the processing application of each material (glass, film, resin, etc.)

・ Achieves high-precision processing by combining full-cut and half-cut processing of laser

feature

-Since there is no mechanical contact like a diamond wheel, scratches, chips, etc. do not occur on the divided surface.

-Automatic peeling function of the terminal part

・ High stability is achieved by laser control using in-house developed software.

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