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Electronic device manufacturing equipment
Laser cutting system
overview
overview
・ Laser can be selected according to the processing application of each material (glass, film, resin, etc.)
・ Achieves high-precision processing by combining full-cut and half-cut processing of laser
feature
-Since there is no mechanical contact like a diamond wheel, scratches, chips, etc. do not occur on the divided surface.
-Automatic peeling function of the terminal part
・ High stability is achieved by laser control using in-house developed software.
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