Electronic device manufacturing equipment
Laser cutting system
・ Laser can be selected according to the processing application of each material (glass, film, resin, etc.)
・ Achieves high-precision processing by combining full-cut and half-cut processing of laser
-Since there is no mechanical contact like a diamond wheel, scratches, chips, etc. do not occur on the divided surface.
-Automatic peeling function of the terminal part
・ High stability is achieved by laser control using in-house developed software.