top of page

Electronic device manufacturing equipment

Laser cutting system



・ Laser can be selected according to the processing application of each material (glass, film, resin, etc.)

・ Achieves high-precision processing by combining full-cut and half-cut processing of laser


-Since there is no mechanical contact like a diamond wheel, scratches, chips, etc. do not occur on the divided surface.

-Automatic peeling function of the terminal part

・ High stability is achieved by laser control using in-house developed software.

DIT レーザー.png
bottom of page