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Laser cutting system
Laser divider

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overview

・ This device is for each material (glass, film, resin, etc.)

Select the laser according to the processing application.

・ Sheets such as glass, film, and resin have been entered.

Galvano + stage synchronous drive based on data

Cut into any shape.

example:

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​feature

-Achieves high-precision machining and machining accuracy.

-No processing residue (soot) adheres to the area around the cut part.

・ Measured value of finished outer shape and residue around the cut part

Quality control is performed depending on the presence or absence.

・ Panel ID, laser output, measured value, surface potential

Being able to stockpile.

・ Laser division is applied to the surface of the glass substrate.

Mechanical contact like a diamond wheel

Since there is no such thing, there are no scratches or chips on the divided surface.

specification

·Construction:

Laser & optics unit

Pilling unit

Main work table

Loading & unloading

* Please contact us for detailed structure and specifications.

Renova Solutions Co., Ltd.

Renova Solutions Co., Ltd.

Tokyo Head Office

Tama Center Tosei Building 3F, 1-15-2 Ochiai,

Tama City, Tokyo 206-0033

 

 

Osaka Branch

〒550-0005

1-6-2 Nishihonmachi, Nishi-ku, Osaka  Awabori Building 3F

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